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Induced Start Dynamic Sampling for Wafer Metrology Optimization

Articolo
Data di Pubblicazione:
2020
Abstract:
Metrology, which plays an important role in ensuring production quality in modern manufacturing industries, incurs substantial costs both in terms of the infrastructure required and the time needed to perform measurements. In particular, in the semiconductor manufacturing industry, measuring fundamental quantities on different sites of a wafer surface is associated with increased production time. To increase metrology efficiency, a typical strategy is to limit the number of sites measured and to exploit statistical models (soft sensing) to reconstruct the wafer profile. Moreover, for quality reasons, spatial dynamic sampling strategies may be employed to ensure that all regions of a wafer surface are checked periodically during production. In this paper, we propose a new sampling strategy, called induced start dynamic sampling (ISDS), which adapts greedy feature selection algorithms to the spatial dynamic sampling problem, such that the number of measured sites at each process run is m...
Tipologia CRIS:
01.01 - Articolo in rivista
Keywords:
Chemical vapor deposition (CVD); dynamic sampling; feature selection; Industry 4.0; semiconductor manufacturing; virtual metrology; wafer profile reconstruction;
Elenco autori:
Susto, G. A.; Maggipinto, M.; Zocco, F.; Mcloone, S.
Autori di Ateneo:
SUSTO GIAN ANTONIO
Link alla scheda completa:
https://www.research.unipd.it/handle/11577/3325148
Link al Full Text:
https://www.research.unipd.it//retrieve/handle/11577/3325148/945984/unpaywall-bitstream--1985244892.pdf
Pubblicato in:
IEEE TRANSACTIONS ON AUTOMATION SCIENCE AND ENGINEERING
Journal
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